[1]何星蔚,张金杰,王恒旭,等.双酚A环氧树脂/双氰胺/SiO2甲基咪唑体系研究[J].林业工程学报,2018,3(03):63-67.[doi:10.13360/j.Issn.2096-1359.2018.03.011]
 HE Xingwei,ZHANG Jinjie,WANG Hengxu,et al.Study on an bisphenol epoxy resin/dicyandiamide/2-MI system[J].Journal of Forestry Engineering,2018,3(03):63-67.[doi:10.13360/j.Issn.2096-1359.2018.03.011]
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双酚A环氧树脂/双氰胺/SiO2甲基咪唑体系研究()
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《林业工程学报》[ISSN:1001-8081/CN:32-1160/S]

卷:
3
期数:
2018年03期
页码:
63-67
栏目:
林产化学加工
出版日期:
2018-05-15

文章信息/Info

Title:
Study on an bisphenol epoxy resin/dicyandiamide/2-MI system
文章编号:
2096-1359(2018)03-0063-05
作者:
何星蔚1张金杰1王恒旭1傅深渊1庞久寅2王发鹏12*
1.浙江农林大学工程学院,杭州 311300;
2.北华大学,吉林 吉林 132000
Author(s):
HE Xingwei1 ZHANG Jinjie1 WANG Hengxu1 FU Shenyuan1 PANG Jiuyin2 WANG Fapeng12*
1.Engineering College, Zhejiang A & F University, Hangzhou 311300, China;
2.Beihua University, Jilin 132000, Jilin, China
关键词:
2-甲基咪唑 E-51环氧树脂 改性 力学性能 热重分析 扫描电镜
Keywords:
2-methylimidazole E-51 epoxy resin modify mechanical property TGA SEM
分类号:
TQ323.5
DOI:
10.13360/j.Issn.2096-1359.2018.03.011
文献标志码:
A
摘要:
为研究中温固化环氧树脂固化体系改善常见高温固化环氧树脂的应用受限及不足,笔者以双氰胺(DCD)为环氧树脂固化剂,2-甲基咪唑(2-MI)为促进剂,通过溶剂交换和熔融共混相结合的方法制备了环氧树脂/2-甲基咪唑/双氰胺的改性环氧树脂复合材料。试验通过添加不同质量分数的2-MI分析环氧树脂性能的变化。采用冲击、拉伸性能测试、热重分析(TGA)和扫描电镜(SEM)方法研究了复合材料的力学性能、热稳定性及断面形貌。结果表明,2-MI的加入可有效改善体系的拉伸和冲击强度,且加入质量分数为0.4%~0.5%时最佳,断裂伸长率显著提升,起到明显增强和增韧作用。扫描电镜显微镜分析结果表明,加入固化剂的环氧树脂复合材料界面黏合性更好,但2-MI的加入量对体系热稳定性无明显影响。
Abstract:
Most epoxy resins cure under high temperature, which limit their applications. An epoxy resin cured at medium temperature was developed in this study, and in this resin system, dicyandiamide(DCD)and 2-methyl imidazole(2-MI)were chosen as the curing agent and accelerant, respectively. The effect of the addition of 2-MI in the DCD/EP system on the physical and mechanical properties of the modified epoxy resin was investigated. The EP/2-MI/DCD modified epoxy resin composites were prepared by a method combined of solvent exchanging and melt mixing. The mechanical properties of the resin composite were investigated by tensile, and impact test and thermal stability of the composites were studied by using thermogravimetric analysis(TGA). The fractured surfaces of the cured samples were investigated by the scanning electron microscopy(SEM)to characterize its morphological structure. The results showed that the impact and tensile strength of the composites both increased with the 2-MI addition. The optimal amount of 2-MI in the epoxy adhesives was between 0.4 wt% and 0.5 wt%, at which the tensile strength reached the highest value of 72.54 MPa(2-MI addition was 0.4 wt%), and the maximum impact strength was up to 14.99 kJ/m2 (2-MI addition was 0.5 wt%). Meanwhile, the toughness of the dipping laminated plate also increased along with the addition of 2-MI. The results of the SEM analysis showed that the modified epoxy resin was more firm and compact, indicated that the properties of the modified epoxy resin was improved. However, the results of thermogravimetric analysis showed that the addition of 2-MI had no significant effect on the thermal stability of the resin composite. The addition of 2-MI might form a three-dimensional network structure in the epoxy resin macro-molecule when the bisphenol-A epoxy resin cured, which thus gave the epoxy resin a stable structure with infusible and insoluble properties, as well as a considerable thermal stability and heat resistance.

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备注/Memo

备注/Memo:
收稿日期:2017-08-23 修回日期:2017-10-24
基金项目:国家自然科学基金(31270589)。
作者简介:何星蔚,女,研究方向为生物质能源与材料。通信作者:王发鹏,男,博士。E-mail: wfp880808@163.com
更新日期/Last Update: 2018-05-15